WANG, Michael Yu   http://www2.acae.cuhk.edu.hk/~yuwang/ywang_cn4.gif

Professor
ASME Fellow, HKIE Fellow, IEEE Fellow

BS, Xi'an Jiaotong University
MS, Pennsylvania State University
PhD, Carnegie Mellon University

Address: 204 William MW Mong Engineering Building
Tel: (852) 2609-8487
Fax: (852) 2603-6002
E-mail: yuwang@mae.cuhk.edu.hk

yuwang2

 

 

Professor Michael Yu Wang has been with CUHK since 2000 and is the director of Computational Modeling and Design Laboratory. Prior to joining CUHK, he had been with the Department of Mechanical Engineering of the University of Maryland at College Park for ten years, where he was an Associate Professor with tenure.

Professor Wang received his B.S degree in Mechanical and Manufacturing Engineering from Xi'an Jiaotong University (China) (1982), M.S. degree in Engineering Mechanics from Pennsylvania State University (1985), and Ph.D. in Mechanical Engineering from Carnegie Mellon University (1989).

He has developed 43 research projects supported by the National Science Foundation (NSF), Boeing, Chrysler, ALCOA, Maryland Industrial Partnerships (MIPS) in USA, by RGC and ITC and local industries in Hong Kong, and by NSFC and MOST in China. He has supervised 10 PhD, 11 MS and 2 MPhil degree students. He is the author of over 200 technical articles and has one US patent.

Professor Wang is an Editorial Board member of Assembly Automation Journal and IEEE Robotics and Automation Magazine. He served as a Senior Editor of IEEE Trans. on Automation Science and Engineering (2003-2008), and an Associate Editor of IEEE Trans. on Robotics and Automation (1998-2002) and of ASME Journal of Manufacturing Science and Engineering (1999-2002). He was the conference chair of 5th ASME Design for Manufacturing Conference in 2000, the Conference Chair (in 2006) and the Program Chair (in 2005) of the IEEE Conference on Automation Science and Engineering, and the Program Chair of IEEE/ASME International Conference on Advanced Intelligent Mechatronics (2008).

He received a Research Initiation Award from USA NSF (1993), a Ralph R. Teetor Educational Award from SAE in 1994 and a LaRoux K. Gillespie Outstanding Young Manufacturing Engineer Award from Society of Manufacturing Engineers in 1995, and was a Boeing - A.D. Welliver Faculty Summer Fellow in 1998. He received the Kayamori Best Paper Award of 2001 IEEE International Conference on Robotics and Automation, the Best Conference Paper Award of 2007 International CAD Conference & Exhibition, the Compliant Mechanisms Award-Theory of ASME 31st Mechanisms and Robotics Conference in 2007, and the Best Paper Award in Information (with P. Song and X. J. Wu) of IEEE International Conference on Information and Automation (2009). He was awarded the Distinguished Young Investigator Award from the Natural Science Foundation of China (NSFC) (2002) and the Science and Technology Development Award (Second Class) from the Ministry of Education of China (2004). He was named Chang Jiang (Cheung Kong) Scholar by the Ministry of Education (China) and Li Ka Shing Foundation (Hong Kong) in 2005, and Distinguished Overseas Scholar by the Chinese Academy of Sciences in 2008. He was awarded the Research Excellence Award (07/08) of CUHK. He is a Distinguished Lecturer of IEEE Robotics and Automation Society (2006-2009). He is a fellow of ASME, HKIE, and IEEE.

He was a visiting scholar in the Department of Mechanical Engineering of Stanford University in Summer 2003, an A*STAR OAP Fellow in Nanyang Technological University, Singapore in 2003,  and a Guest Professor in Shanghai Jiaotong University and Haerbin Institute of Technology in China. He is Chang Jiang Chair Professor at Huazhong University of Science and Technology.

For More Information:

A biographic sketch Curriculum Vita  (中文简历)

For Recent Projects, Activities, Publication Downloads, and Student Information:

Computational Modeling and Design Laboratory

Research Interests:

Geometric, Structural, Material & Nano Design & Optimization:

  • Structural shape and topology optimization with level-set based methods
  • Multi-phase level-set models for heterogeneous material design & optimization
  • Design and optimization of banded and gradient materials and structures
  • Geometric modeling for generative design and optimization

Automation for Electronic Packaging:

  • Micro-motion stages and systems for precision positioning and alignment
  • Active, passive, and in-package alignment technology for photonics 
  • Particle damping for vibration control and precision applications

Energy Harvesting from Vibrations:

  • Modeling and analysis of photonic/phononic banded materials
  • Energy harvesting with photonic band-gap systems

Manufacturing and Automation:

  • Automated design of high performance fixtures
  • Haptic simulation and planning of multi-body contact tasks

 

Recent Publications (see our lab web pages):

Computational Modeling and Design Laboratory

Recent Research Grants:

  • HKSAR Research Grants Council (RGC) General Research Fund (GRF), 10/1/2009-9/30/2012, HK$1,068,000, Structural Topology Optimization with Radial Basis Function Based Level Set Method: Moving Knots and Partition of Unity Techniques (CUHK/417309) (PI).
  • HKSAR Research Grants Council (RGC) General Research Fund (GRF), 10/1/2008-9/30/2011, HK$779,000, An Elasto-Kinematic Approach to Optimizing Continuum Compliant Mechanisms (CUHK/417708) (PI).
  • HKSAR Research Grants Council (RGC) Competitive Earmarked Research Grant (CERG), 10/1/2007-9/30/2010, HK$897,000, Passive Compliant Assembly of Hybrid MEMS (CUHK/416507) (PI).
  • HKSAR Research Grants Council (RGC) Competitive Earmarked Research Grant (CERG), 10/1/2006-9/30/2009, HK$534,000, Precision Fiber-Optic Align and Attach Techniques for Photonics Manufacturing Automation (CUHK/416206) (PI).
  • HKSAR Innovation and Technology Fund (ITF) and ASM Assembly Automation Ltd., 1/2006 – 1/2008, HK$2,047,000. Optimization Technologies for High Dynamic Performance in Electronics Manufacturing Equipment (UIM/169). (PI & Project Coordinator).
  • HKSAR Research Grants Council (RGC) Competitive Earmarked Research Grant (CERG), 10/1/2005 – 9/30/2008, HK$705,464, Design and Optimization of Heterogeneous Objects Using Multi-Phase Level-Set Models and Topological Derivatives (CUHK/416205). (PI).
  • HKSAR Research Grants Council (RGC) Competitive Earmarked Research Grant (CERG), 7/1/2004 – 6/30/2007, HK$506,446, Analysis and Planning of Passive Force Closures in Fixturing and Power-Grasping (CUHK4215/04E). (PI).
  • The Chinese University of Hong Kong Postdoctoral Fellowship Grant (03/ERG/12, 04/ERG/1), HK$122,328, 13-6-2004-13-6-2006 (PI).
  • The Ministry of Science and Technology of China, 中华人民共和国科学技术部973计划, 12/1/2003-12/31/2008, CNY4,300,000, Principles and Methods for Design and Manufacturing of High Performance Electronics Products (Co-PI).
  • The Natural Science Foundation of China (NSFC), 国家自然科学基金委 员会, 4/1/2003-31/3/2007, CNY8,000,000, Fundamental Technologies in Advanced Electronics Manufacturing (Co-PI).
  • The Natural Science Foundation of China (NSFC), 国家自然科学基金委 员会, 1/1/2004-12/31/2006, CNY120,000, Planning, Scheduling and Simulation of Reverse Supply Chain for Electronics Recycling (Co-PI).
  • The Natural Science Foundation of China (NSFC), 国家自然科学基金委 员会, 1/1/2004-12/31/2006, CNY160,000, Level-Set Based Methods for Multi-Material Structural Optimization (Co-PI).
  • HKSAR Research Grants Council (RGC) Competitive Earmarked Research Grant (CERG), 7/1/2003 – 6/30/2006, HK$636,439, Structural Shape and Topology Optimization Using Level-Set Methods (CUHK4164/03E). (PI).
  • HKSAR Research Grants Council (RGC) Competitive Earmarked Research Grant (CERG), 7/1/2002 – 6/30/2005, HK$797,404, Interactive Haptic Simulation for Virtual Fixture Prototyping (CUHK4376/02E). (PI).
  • The Chinese University of Hong Kong Postdoctoral Fellowship Grant, 6/1/2002 – 5/31/2003, HK$185,000. (PI).
  • The Natural Science Foundation of China (NSFC), 国家自然科学基金委 员会, 1/2002 – 12/2004, CNY400,000. The Overseas (Hong Kong) Young Investigator Collaboration Award (50128503). (PI).
  • HKSAR Research Grants Council (RGC) Competitive Earmarked Research Grant (CERG), 7/1/2001 – 6/30/2004, HK$651,281, Minimally-Invasive Techniques of Particle Vibration Damping (CUHK4196/01E). (PI).
  • HKSAR Research Grants Council (RGC) Competitive Earmarked Research Grant (CERG), 7/1/2001 – 6/30/2004, HK$836,105, 3D Grasp Planning with Applications to Automated Fixture Layout Design (CUHK4217/01E). (Co-PI).
  • HKSAR Innovation and Technology Fund (ITF) and Various Industrial Sponsors, 6/1/2001 – 5/31/2004, HK$13,042,000. Photonic Packaging Laboratory (ITS/057/01). (Co-PI).
  • HKSAR Innovation and Technology Fund (ITF) and ASM Assembly Automation Ltd., 7/1/2000 – 6/30/2002, HK$1,040,000. Novel Technologies for High-Performance Vibration Damping and Compact Motion-Stages for Electronics Manufacturing Equipment (UIM/16). (Deputy Project Coordinator).
  • The Chinese University of Hong Kong Direct Research Grant, 10/1/2000 – 9/30/2002, HK$150,000. High-Performance Workpiece Fixturing. (PI).
  • The Croucher Foundation, 9/1/2000 – 2/28/2001, HK$120,000. Visitorship for a PRC Scholar: Particle Damping for Vibration Reduction. (PI).
  • The Ministry of Education of China, 6/2000 – 6/2002, CNY100,000. The State Key Laboratory Visiting Scholar Grant: Laboratory for Manufacturing Systems Engineering, Xian Jiaotong University.

Special Interest:

IEEE Transactions on Automation Science and Engineering
IEEE Conference on Automation Science and Engineering (IEEE CASE)

Last Modified: November 3, 2009